E7S系列Q670平臺(tái) 嵌入式工控機(jī)/BOX
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產(chǎn)品描述
阿普奇嵌入式工控機(jī)E7S系列Q670平臺(tái)是一款功能強(qiáng)大的嵌入式工控機(jī)，專為工業(yè)自動(dòng)化和邊緣計(jì)算應(yīng)用而設(shè)計(jì)。該平臺(tái)支持最新的Intel處理器，包括12和13代Core、Pentium和Celeron系列，提供高效性能和穩(wěn)定運(yùn)行。支持Intel? 12/13th Gen Core / Pentium/ Celeron Desktop CPU，這些處理器具有65W的TDP和LGA1700封裝，可提供出色的性能和能效。采用Intel? Q670芯片組，為系統(tǒng)提供穩(wěn)定的硬件平臺(tái)和豐富的擴(kuò)展功能。2個(gè)Intel網(wǎng)絡(luò)接口（11GbE & 12.5GbE），確保高速穩(wěn)定的網(wǎng)絡(luò)連接，滿足大數(shù)據(jù)傳輸和實(shí)時(shí)通信的需求。具有3路顯示輸出，包括HDMI、DP++和內(nèi)部LVDS。最高支持4K@60Hz分辨率，滿足高清晰度顯示需求。提供豐富的USB、串口擴(kuò)展接口和PCIe、mini PCIe、M.2擴(kuò)展插槽，可根據(jù)具體應(yīng)用需求進(jìn)行定制配置，滿足各種復(fù)雜的工業(yè)自動(dòng)化需求。智能風(fēng)扇主動(dòng)散熱設(shè)計(jì)，確保系統(tǒng)在高負(fù)載下的穩(wěn)定運(yùn)行。
綜上所述，阿普奇E7S系列Q670平臺(tái)嵌入式工控機(jī)憑借出色的性能、豐富的接口和高效的散熱設(shè)計(jì)，為工業(yè)自動(dòng)化和邊緣計(jì)算提供了強(qiáng)大支持，滿足各種復(fù)雜應(yīng)用場(chǎng)景的需求。
|
Model |
E7S |
E7DS |
E7QS |
|
|
CPU |
CPU | Intel??12/13th Generation Core / Pentium/ Celeron Desktop CPU | ||
| TDP | 65W | |||
| Socket | LGA1700 | |||
| Chipset | Q670 | |||
| BIOS | AMI 256 Mbit SPI | |||
|
Memory |
Socket | 2 * Non-ECC SO-DIMM Slot, Dual Channel DDR4 up to 3200MHz | ||
| Max Capacity | 64GB, Single Max. 32GB | |||
|
Graphics |
Controller | Intel??UHD Graphics | ||
|
Ethernet |
Controller | 1 * Intel i219-LM 1GbE LAN Chip (LAN1, 10/100/1000 Mbps, RJ45) 1 * Intel i225-V 2.5GbE LAN Chip (LAN2, 10/100/1000/2500 Mbps, RJ45) |
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|
Storage |
SATA | 1 * SATA3.0, Quick release 2.5" hard disk bays (T≤7mm) 1 * SATA3.0, Internal 2.5" hard disk bays (T≤9mm, Optional) Support?RAID?0, 1, 5 |
||
| M.2 | 1 * M.2 Key-M (PCIe x4 Gen 4 + SATA3.0, NVMe/SATA SSD Auto Detect, 2280) | |||
|
Expansion Slots |
PCIe Slot | N/A | ①: 1 * PCIe x16 (x16) + 1 * PCIe x4 (x4)
②: 1 * PCIe x16 + 1 * PCI ③: 2 * PCI PS: ①、②、③?One out of three, Expansion card length ≤ 185mm, TDP ≤ 130W |
①: 2 * PCIe x16 (x8/x8) + 2 * PCI
②:1?* PCIe x16 (x16) + 1 * PCIe x4 (x4) PS: ①、②?One out of two, Expansion card length ≤ 185mm, TDP ≤ 130W |
| aDoor | 1 * aDoor Bus (Optional 4 * LAN/4 * POE/6 * COM/16 * GPIO expansion card) | |||
| Mini PCIe | 2 * Mini PCIe (PCIe x1 Gen 3 + USB 2.0, with 2 * SIM Card) | |||
| M.2 | 1 * M.2 Key-E (PCIe x1 Gen 3 + USB 2.0, 2230) | |||
|
Front I/O |
Ethernet | 2 * RJ45 | ||
| USB | 2 * USB3.2 Gen2x1 (Type-A, 10Gbps) 6 * USB3.2 Gen 1x1 (Type-A, 5Gbps) |
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| Display | 1 * HDMI1.4b: max resolution up to 4096*2160 @ 30Hz 1 * DP1.4a: max resolution up to 4096*2160 @ 60Hz |
|||
| Audio | 2 * 3.5mm Jack (Line-Out + MIC) | |||
| Serial | 2 * RS232/485/422 (COM1/2, DB9/M, Full Lanes, BIOS Switch) 2 * RS232 (COM3/4, DB9/M, Full Lanes) |
|||
| Button | 1 * Power Button + Power LED 1 * AT/ATX Button 1 * OS Recover Button 1 * System Reset Button |
|||
|
Rear I/O |
Antenna | 4 * Antenna hole | ||
| SIM | 2 * Nano SIM card?slots | |||
|
Internal I/O |
USB | 6 * USB2.0 (wafer) | ||
| LCD | 1 * LVDS (wafer): LVDS Resolution up to 1920*1200 @ 60Hz | |||
| Front Panel | 1 * FPanel (PWR+RST+LED, wafer) | |||
| Audio | 1 * Audio (Header) 1 * Speaker (2-W (per channel)/8-Ω Loads, wafer) |
|||
| Serial | 2 * RS232 (COM5/6, wafer) | |||
| GPIO | 1 * 16 bits DIO (8xDI and 8xDO, wafer) | |||
| LPC | 1 * LPC (wafer) | |||
| SATA | 3 * SATA 7P Connector, up to 600MB/s | |||
| SATA Power | 3 * SATA Power (wafer) | |||
| FAN | 1 * CPU FAN (wafer) 2 * SYS FAN (KF2510-4A) |
|||
|
Power Supply |
Type | DC, AT/ATX | ||
| Power Input Voltage | 9~36VDC, P≤240W 18~60VDC, P≤400W |
|||
| Connector | 1 * 4Pin Connector, P=5.00/5.08 | |||
| RTC Battery | CR2032 Coin Cell | |||
|
OS Support |
Windows | Windows 10/11 | ||
| Linux | Linux | |||
|
Watchdog |
Output | System Reset | ||
| Interval | Programmable 1 ~ 255 sec | |||
|
Mechanical |
Enclosure Material | Radiator: Aluminum alloy, Box: SGCC | ||
| Dimensions | 268mm(L) * 194.2mm(W) * 67.7mm(H) | 268mm(L) * 194.2mm(W) * 118.5mm(H) | 268mm(L) * 194.2mm(W) * 159.5mm(H) | |
| Weight | Net: 4.5 kg
Total: 6 kg (Include packaging) |
Net:?4.7kg
Total: 6.2 kg (Include packaging) |
Net: 4.8 kg
Total: 6.3 kg (Include packaging) |
|
| Mounting | VESA, Wall mounted, Desktop | |||
|
Environment |
Heat Dissipation System | PWM FAN Cooling | ||
| Operating Temperature | -20~60℃?(Industrial SSD) | |||
| Storage Temperature | -40~80℃?(Industrial SSD) | |||
| Relative Humidity | 10 to 90% RH (non-condensing) | |||
| Vibration During Operation | With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis) | |||
| Shock During Operation | With SSD: IEC 60068-2-27 (30G, half sine, 11ms) | |||
| Certification | CE/FCC, RoHS | |||
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嵌入式工控機(jī)/BOX E7S系列Q670平臺(tái)
